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HMXADC9225
Radiation Hardened 12-Bit, 20 MSPS Monolithic A/D Converter
The HMXADC9225 is a radiation hardened monolithic, single supply, 12-bit, 20 MSPS, analog-to-digital converter with an on-chip, high performance sample-andhold amplifier. The HMXADC9225 uses a multistage differential pipelined architecture with output error correction logic to provide 12-bit accuracy at 20 MSPS data rates, and guarantees no missing codes over the full operating temperature range. The HMXADC9225 is fabricated on a radiation hardened SOI-IV Silicon On Insulator (SOI) process with very low power consumption. The input of the HMXADC9225 allows for easy interfacing to space and military imaging, sensor, and communications systems. With a truly differential input structure, the user can select a variety of input ranges and offsets including singleended applications. The dynamic performance is excellent. The sample-and-hold amplifier (SHA) is well suited for both multiplexed systems that switch full-scale voltage levels in successive channels and sampling single-channel inputs at frequencies up to and well beyond the Nyquist rate. A single clock input is used to control all internal conversion cycles. The digital output data is presented in straight binary output format.
FEATURES
Monolithic 12-Bit, 20 MSPS A/D Converter Rad Hard: >500k Rad(Si) Total Dose Single +5 V Analog Supply Complete On-Chip S/H Amplifier Straight Binary Output Data 5V or 3.3V Digital and I/O Supply No Missing Codes Guaranteed Differential Nonlinearity Error: 0.4 LSB Signal-to-Noise and Distortion Ratio: 69.6 dB Spurious-Free Dynamic Range: -81 dB 28-Lead Ceramic Flat Pack Mixed Signal Rad Hard Process The HMXADC9225 is fabricated on space qualified SOI CMOS process. High-speed precision analog circuits are now combined with high-density logic circuits that can reliably withstand the harshest environments. Space Qualified Package The HMXADC9225 is packaged in a 28 lead ceramic flat pack. Low Power The HMXADC9225 at 345 mW consumes a fraction of the power of presently available in existing monolithic solutions. Output Enable (OE) The OE input allows user to put the tri-state digital outputs into a high impedance mode. Dual Power Supply Capability The HMXADC9225 uses a single +5 V power supply simplifying system power supply design. It also features a separate digital I/O power supply line to accommodate 3.3V and 5V logic families. On-Chip Sample-and-Hold (SHA) The versatile SHA input can be configured for either single-ended or differential inputs.
HMXADC9225
BLOCK DIAGRAM
REFP, REFN VINP S/H VINN MDAC1 X16 MDAC2 X4 MDAC3 X4 Correct Logic Data Output Drivers Output Tri-State Control D0 - D11 DRVDD DRVSS
A/D Clock in
A/D
A/D
A/D
5
Clock Buffer CML Gen Master Bias IREF
3
3
4
REFT Diff Buffer REFB
Output Enable
CML
AVDD AVSS REFCOM RBIAS VREF * = 0.1 uF in parallel with a 10uF Cap * 0.1uF
5k
External Reference Input 0.1uF
PIN DESCRIPTION
Pin 1 2 3-12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 Pin Name CLK BIT 12 BIT 11 - 2 BIT 1 OE AVDD AVSS RBIAS VREF INPUT REFCOMM REFB REFT CML VINA VINB AVSS AVDD DRVSS DRDVDD Description Clock Input Least Significant Data Bit (LSB) Data Output Bit Most Significant Bit (MSB) Output Enable (high active) +5V Analog Supply Analog Ground Reference Current Bias Resistor Reference Voltage Input Reference Common Noise Reduction Pin Noise Reduction Pin Common Mode Level (AVDD/2) Analog Input (+) Analog Input (-) Analog Ground +5V Analog Supply Digital Output Driver Ground +5V or 3.3V Digital Output Driver Supply
1 CLK 2 3 4 5 6 7 8 9 BIT 12 (LSB) BIT 11 BIT 10 BIT 9 BIT 8 BIT 7 BIT 6 BIT5 DRVDD 28 DRVSS AVDD 27 26
AVSS 25 VIN B 24 VIN A 23
CML 22 REFT REFB 21 20
10 BIT 4 11 BIT 3 12 BIT 2 13 BIT 1 (MSB) 14 OE
REFCOM 19 VREF IN 18 RBIAS 17 AVSS 16 AVDD 15
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HMXADC9225
SIGNAL DEFINITION
DRVDD The Digital Output Power Supply (DRVDD) can operate at either 5.0V or 3.3V. The DRVDD voltage defines the interface voltage level for all the digital I/O signals including Clock input, Output Enable, and all data output signals. OUTPUT ENABLE (OE) This signal controls the electrical state of the digital output drivers. A high logic level will enable the outputs and a low logic level will put the output drivers into a high impedance state. RBIAS R-Bias is required to create the internal bias currents. An external resistor with a value of 5k shall be connected between pin 17 and ground. The R-Bias resistor can also be used to change the power consumption. By changing the resistor value, the current consumption can be changed. The range of this feature not yet characterized. VOLTAGE REFERENCE INPUT The HMXADC9225 requires the user to provide an external voltage reference as an INPUT to the device. The device is designed to operate using a 1.0V to 2.0V external voltage reference. The input range will then be defined by the VREF. The full scale signal input = 2 x VREF. Signals outside this range will be considered "out of range". CML (Common Mode Level) This signal is an analog output at a value of AVDD/2. It can be used as a reference for biasing external circuits to a "mid-rail" value. This signal should be decoupled with a 0.1uF capacitor. Total Ionizing Radiation Dose The HMXADC9225 will meet all stated functional and electrical specifications over the entire operating temperature range after the specified total ionizing radiation dose. All electrical and timing performance parameters will remain within specifications after rebound at VDD = 5.0 V extrapolated to ten years of operation. Total dose hardness is assured by wafer level testing of process monitor transistors using 10 KeV X-ray and Co60 radiation sources. Transistor gate threshold shift correlations have been made between 10 KeV X-rays applied at a dose rate of 1x105 rad(SiO2)/min at T=25C and gamma rays (Cobalt 60 source) to ensure that wafer level X-ray testing is consistent with standard military radiation test environments. Transient Pulse Ionizing Radiation The HMXADC9225 will meet any functional or electrical specification after exposure to a radiation pulse up to the transient dose rate survivability specification, when applied under recommended operating conditions. Note that the current conducted during the pulse by the ADC inputs, outputs, and power supply may significantly exceed the normal operating levels. The application design must accommodate these effects. Soft Error Rate The HMXADC9225 is not guaranteed to operate through an SEU or dose rate event, but it will recover and continue to meet all specifications over the full temperature range after an event. Latchup and Snapback The HMXADC9225 will not latch up due to any of the above radiation exposure conditions when applied under recommended operating conditions. Fabrication with the SIMOX substrate material provides oxide isolation between adjacent PMOS and NMOS transistors and eliminates any potential SCR latchup structures. Sufficient transistor body tie connections to the p- and n-channel substrates are made to ensure no source/drain snapback occurs.
RADIATION PERFORMANCE ANALOG SAMPLING TIMING DIAGRAM
S1 Analog Input tC S3 tCH tCL S2
S4
Clock Data Out
tOD Data 1
3
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HMXADC9225
OUTPUT ENABLE TIMING DIAGRAM
OE
50
D1-D12 85pF TDLZ TDHZ (a) TDZL TDZH (b)
Output Enable Timing Diagram (a) and Effective Load (b)
SWITCHING SPECIFICATIONS (TMIN to TMAX
Parameter Clock Period (1) Clock Pulsewidth High (46% of tc) (1) Clock Pulsewidth Low (46% of tc) (1) Output Delay
with AVDD = +5V, DRVDD = +5V, CL = 85 pF)
Symbol tC tCH tCL tOD
Min 50 23 23 3
Typ
Max
25 50 50 50 50 50 50 50 50
Units ns ns ns ns ns ns ns ns ns ns ns ns
High Z to Output High (DRVDD=5V) TDZH_50 3 High Z to Output Low (DRVDD=5V) TDZL_50 3 Output High to High Z (DRVDD=5V) TDHZ_50 3 Output Low to High Z (DRVDD=5V) TDLZ_50 3 High Z to Output High (DRVDD=3.3V) TDZH_33 3 High Z to Output Low (DRVDD=3.3V) TDZL_33 3 Output High to High Z (DRVDD=3.3V) TDHZ_33 3 Output Low to High Z (DRVDD=3.3V) TDLZ_33 3 (1) - These are parameters of the input clock signal to the chip. (2) - Guaranteed but not tested.
RADIATION SPECIFICATIONS (TMIN to TMAX
with AVDD = +5V, DRVDD = +5V, CL = 20 pF)
Parameters Min Max Units Total Dose Hardness >5 x 105 Rad (Si) Dose Rate Upset Hardness >2.5 x 1012 Rad(Si)/sec 12 Dose Rate Survivability >2.5 x 10 Rad(Si)/sec Soft Error Rate LET (1) 120 MeV cm2/mg Soft Error Rate (2) <1x10-10 Upsets/bit-day Latch Up Immune (1) The HMXADC9225 will recover and continue to meet all specifications. (2) This error rate applies to only the logic portion of the device.
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HMXADC9225
ABSOLUTE MAXIMUM RATINGS
(AVDD = +5V, DRVDD = +5V, unless otherwise noted)
Parameters Min AVDD DRVDD AVSS -0.3 DRVSS -0.3 REFGND -0.3 CLK, OE D1-D12 VINA, VINB VREF REFT, REFB Junction Temperature NOTE: All voltages are with respect to VSS = 0V.
Max 6.5 6.5
6.5 6.5 6.5 6.5 6.5 +175
Units Volts Volts Volts Volts Volts Volts Volts Volts Volts Volts C
RECOMMENDED OPERATING CONDITIONS
Parameters Min Typ Max AVDD 4.75 5 5.25 DRVDD (for 5V I/O operation) 4.75 5 5.25 DRVDD (for 3.3V I/O 3.3 3.0 3.6 operation) AVSS -0.3 0 DRVSS -0.3 0 REFGND -0.3 0 CLK, OE DRVDD + 0.5 D1-D12 5.5 VINA, VINB 0.5 4.5 VREF 1.0 2.0 REFT, REFB 5.5 Operating Temperature (case) -55 +125 NOTE: All voltages are with respect to VSS = 0V. Units Volts Volts Volts Volts Volts Volts Volts Volts Volts Volts Volts C
ESD (Electrostatic Discharge) Sensitive
The HMXADC9225 is rated as Class I ESD. Proper ESD precautions should be taken to avoid degradation or damage to the device.
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HMXADC9225
DC SPECIFICATIONS
(AVDD = +5V, DRVDD = +5V, fSAMPLE = 20 MSPS, VREF 2.0V, VINB = 2.5V dc, TMIN to TMAX unless otherwise noted)
Parameter Symbol Min Typ Max RESOLUTION (1) 12 MAX CONVERSION RATE (1) 20 INPUT REFERRED NOISE VREF = 2V (1) 0.17 ACCURACY Integral Nonlinearity INL -2.5 2.5 1.2 Differential Nonlinearity DNL -1.3 1.3 0.4 No Missing Codes (1) 12 OFFSET -0.6 0.9 Zero Error (@ 25C) 0.3 GAIN -2 2 Gain Error (@ 25C) 0.5 TEMPERATURE DRIFT +/- 2 Zero Error (@ 25C) (1) +/- 26 Gain Error (@ 25C) (1) ANALOG INPUT Input Span 4 Input Capacitance (1) 10 EXTERNAL VOLTAGE REFERENCE Input Voltage (2) 1.0 2.0 2.0 Input Current 250 500 Power Supply Currents IAVDD, IDVDD 65 IDRVDD 2 CML Output Current (3) 0.5 1.0 RBIAS Resistor Value 5 (1) Guaranteed but not tested. (2) Recommended VREF tolerance is +/-110 mV. (3) It is recommended an external buffer be used for driving external circuitry.
Units Bits MHz LSB rms LSB LSB Bits guaranteed % FSR % FSR PPM/C PPM/C V p-p pF V A mA mA mA K
AC SPECIFICATIONS
(AVDD = +5V, DRVDD = +5V, fSAMPLE = 20 MSPS, VREF 2.0V, TMIN to TMAX Differential Input unless otherwise noted)
Parameter SIGNAL TO NOISE AND DISTORTION fIN = 1MHz SIGNAL TO NOISE AND DISTORTION fIN = 5MHz SIGNAL TO NOISE RATIO fIN = 1MHz SIGNAL TO NOISE RATIO fIN = 5MHz TOTAL HARMONIC DISTORTION fIN = 1MHz TOTAL HARMONIC DISTORTION fIN = 5MHz SPURIOUS FREE DYNAMIC RANGE fIN = 1MHz SPURIOUS FREE DYNAMIC RANGE fIN = 5MHz Full Power Bandwidth (1) Small Signal Bandwidth (1) Aperture Delay (1) Aperture Jitter (1) Acquisition to Full Scale Step (1) (1) - Guaranteed but not tested.
Symbol SINAD1 SINAD5 SNR1 SNR5 THD1 THD5 SFDR1 SFDR5
Min 63 60 63 60 70 68
Typ 67 66 69 68 -70 -69 72 71 120 120 1 4 10
Max -66 -66 -
Units dB dB dB dB dB dB dB dB MHz MHz ns ps rms ns
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HMXADC9225
DIGITAL SPECIFICATIONS (AVDD = +5V, DRVDD = +5V, unless otherwise noted)
Parameter LOGIC INPUTS (CLK, OE) High Level Input Voltage (DRVDD = +5V) High Level Input Voltage (DRVDD =+3.3V) Low Level Input Voltage (DRVDD = +5V) Low Level Input Voltage (DRVDD = +3.3V) High Level Input Current (DRVDD=5V, VIN=5V) Low Level Input Current (DRVDD=5V, VIN=0V) High Level Input Current (DRVDD=3.3V, VIN=3.3V) Low Level Input Current (DRVDD=3.3V, VIN=0V) Input Capacitance (1) LOGIC OUTPUTS (D1-D12 with DRVDD = +5V) High Level Output Voltage(IOH = 50A) High Level Output Voltage(IOH = 0.5mA) Low Level Output Voltage(IOL = 1.6mA) Low Level Output Voltage(IOL = 50A) High Z Output Current (DRVDD=5V, OE=0V, VOUT=5V) High Z Output Current (DRVDD=5V, OE=0v, VOUT=0V) LOGIC OUTPUTS (D1-D12 with DRVDD = +3.3V) High Level Output Voltage(IOH = 50A) High Level Output Voltage(IOH = 0.5mA) Low Level Output Voltage(IOL = 1.6mA) Low Level Output Voltage(IOL = 50A) High Z Output Current (DRVDD=3.3V, VOE=0V, VOUT=3.3V) High Z Output Current (DRVDD=3.3V, VOE=0V, VOUT=0V) Output Capacitance (1) (1) Guaranteed but not tested. Symbol VIH_50 VIH_33 VIL_50 VIL_33 IIH_50 IIL_50 IIH_33 IIL_33 CIN VOH1_50 VOH2_50 VOL2_50 VOL1_50 IOZH_50 IOZL_50 VOH1_33 VOH2_33 VOL2_33 VOL1_33 IOZH_33 IOZL_33 COUT Min 3.5 2.3 -10 -10 -10 -10 5 4.5 2.4 -10 -10 2.95 2.80 0.4 0.05 -10 -10 5 10 10 0.4 0.1 10 10 1.0 1.0 10 10 10 10 Typ Max Units V V V V A A A A pF V V V V A A V V V V A A pF
DEFINITIONS OF SPECIFICATIONS
INTEGRAL NONLINEARITY (INL) INL refers to the deviation of each individual code from a line drawn from "negative full scale" through "positive full scale." The point used as "negative full scale" occurs 1/2 LSB before the first code transition. "Positive full scale" is defined as a level 1 1/2 LSB beyond the last code transition. The deviation is measured from the middle of each particular code to the true straight line. DIFFERENTIAL NONLINEARITY (DNL, NO MISSING CODES) An ideal ADC exhibits code transitions that are exactly 1 LSB apart. DNL is the deviation from this ideal value. Guaranteed no missing codes to 12-bit resolution indicate that all 4096 codes, respectively, must be present over all operating ranges. ZERO ERROR The major carry transition should occur for an analog value 1/2 LSB below VINA = VINB. Zero error is defined as the deviation of the actual transition from that point. 7
GAIN ERROR The first code transition should occur at an analog value 1/2 LSB above negative full scale. The last transition should occur at an analog value 1 1/2 LSB below the nominal full scale. Gain error is the deviation of the actual difference between first and last code transitions and the ideal difference between first and last code transitions. TEMPERATURE DRIFT The temperature drift for zero error and gain error specifies the maximum change from the initial (+25C) value to the value at TMIN or TMAX. APERTURE JITTER Aperture jitter is the variation in aperture delay for successive samples and is manifested as noise on the input to the A/D. APERTURE DELAY Aperture delay is a measure of the sample-and-hold amplifier (SHA) performance and is measured from the rising edge of the clock input to when the input signal is held for conversion. www.honeywell.com/microelectronics
HMXADC9225
SIGNAL-TO-NOISE AND DISTORTION (S/N+D, SINAD) RATIO S/N+D is the ratio of the rms value of the measured input signal to the rms sum of all other spectral components below the Nyquist frequency, including harmonics but excluding dc. The value for S/N+D is expressed in decibels. EFFECTIVE NUMBER OF BITS (ENOB) For a sine wave, SINAD can be expressed in terms of the number of bits. Using the following formula, N = (SINAD - 1.76)/6.02 it is possible to get a measure of performance expressed as N, the effective number of bits. Thus, effective number of bits for a device for sine wave inputs at a given input frequency can be calculated directly from its measured SINAD. SPURIOUS FREE DYNAMIC RANGE (SFDR) SFDR is the difference in dB between the rms amplitude of the input signal and the peak spurious signal. TOTAL HARMONIC DISTORTION (THD) THD is the ratio of the rms sum of the first six harmonic components to the rms value of the measured input signal and is expressed as a percentage or in decibels. SIGNAL-TO-NOISE RATIO (SNR) SNR is the ratio of the rms value of the measured input signal to the rms sum of all other spectral components below the Nyquist frequency, excluding the first six harmonics and dc. The value for SNR is expressed in decibels.
TYPICAL DNL (10MSPS)
TYPICAL INL (10MSPS)
FUNCTIONAL DESCRIPTION
The HMXADC9225 is a complete high performance single-supply 12-bit ADC. The analog input range of the HMXADC9225 is highly flexible allowing for either single-ended or differential inputs of varying amplitudes that can be AC or DC coupled. It utilizes four-stage pipeline architecture with a wideband input sample-and-hold amplifier (SHA) implemented on an SOI CMOS process. Each stage of the pipeline, excluding the last stage, consists of a lowresolution flash A/D connected to a switched capacitor DAC and interstage residue amplifier (MDAC). The residue amplifier amplifies the difference between the reconstructed DAC output and the flash input for the next stage in the pipeline. One bit of redundancy is used in each of the stages to facilitate digital correction of flash errors. The last stage simply consists of a flash A/D. 8
The pipeline architecture allows a greater throughput rate at the expense of pipeline delay or latency. This means that while the converter is capable of capturing a new input sample every clock cycle, it actually takes three clock cycles for the conversion to be fully processed and appear at the output. This latency is not a concern in most applications. The digital output is latched into an output buffer to drive the output pins. The HMXADC9225 uses both edges of the clock in its internal timing circuitry (see Timing Diagram and specification page for exact timing requirements). The A/D samples the analog input on the rising edge of the clock input. During the clock low time (between the falling edge and rising edge of the clock), the input SHA is in the sample mode; during the clock high time it is in hold. System disturbances just prior to the rising edge of the clock and/or excessive clock jitter may cause the input SHA to acquire the wrong value, and should be minimized. www.honeywell.com/microelectronics
HMXADC9225
ANALOG INPUT OPERATION
Figure 1 shows the equivalent analog input of the HMXADC9225, which consists of a differential sampleand-hold amplifier (SHA). The differential input structure of the SHA is highly flexible, allowing the devices to be easily configured for either a differential or single-ended input. The dc offset, or common mode voltage, of the input(s) can be set to accommodate either single-supply or dual-supply systems. Also, note that the analog inputs, VINA and VINB, are interchangeable with the exception that reversing the inputs to the VINA and VINB pins results in a polarity inversion. Clock Input and Considerations The HMX9225 internal timing uses the two edges of the clock input to generate a variety of internal timing signals. The clock input must meet or exceed the minimum specified pulse width high and low (tCH and tCL) specifications for the given A/D as defined in the Switching Specifications at the beginning of the data sheet to meet the rated performance specifications. For example, the clock input to the HMX9225 operating at 20 MSPS may have a duty cycle between 45% to 55% to meet this timing requirement since the minimum specified tCH and tCL is 23 ns. For low clock rates, the duty cycle may deviate from this range to the extent that both tCH and tCL are satisfied. All high-speed high resolution A/Ds are sensitive to the quality of the clock input. The degradation in SNR at a given full-scale input frequency (fIN) due to only aperture jitter (tA) can be calculated with the following equation:
VIN A VIN B
Figure 1 - Analog Input Equivalent Circuit The full scale signal input = 2 x VREF. In the equation, the rms aperture jitter, tA, represents the root sum square of all the jitter sources, which include the clock input, analog input signal, and A/D aperture jitter specification. Under sampling applications are particularly sensitive to jitter. Clock input should be treated as an analog signal in cases where aperture jitter may affect the dynamic range of the HMXADC9225. Power supplies for clock drivers should be separated from the A/D output driver supplies to avoid modulating the clock signal with digital noise. Low jitter crystal controlled oscillators make the best clock sources. If the clock is generated from another type of source (by gating, dividing, or other method), it should be retimed by the original clock at the last step. The clock input is referred to the analog supply. Its logic threshold is AVDD/2. The HMXADC9225 has a clock tolerance of 5% at 20 MHz and should be a 50% duty cycle. The input circuitry for the CLOCK pin is designed to accommodate CMOS inputs. The quality of the logic input, particularly the rising edge, is critical in realizing the best possible jitter performance of the part: the faster the rising edge, the better the jitter performance. As a result, careful selection of the logic family for the clock driver, as well as the fanout and capacitive load on the clock line, is important. Jitter-induced errors become more predominant at higher frequency, large amplitude inputs, where the input slew rate is greatest. Most of the power dissipated by the HMX9225 is from the analog power supplies. However, lower clock speeds will reduce digital current. www.honeywell.com/microelectronics
DIGITAL INPUTS AND OUTPUTS
Digital Outputs The HMXADC9225 output data is presented in positive true straight binary for all input ranges. The table below indicates the output data formats for various input ranges regardless of the selected input range. A twos complement output data format can be created by inverting the MSB. The outputs can be placed in high impedance tri-state mode and are controlled by the Output Enable (OE) signal. Output Data Format Input (V) Condition (V)
VINA-VINB VINA-VINB VINA-VINB VINA-VINB VINA-VINB < - VREF = - VREF =0 = + VREF - 1 LSB + VREF
Digital Output
0000 0000 0000 0000 0000 0000 1000 0000 0000 1111 1111 1111 1111 1111 1111
Digital Output Driver Considerations (DRVDD) The HMX9225 output drivers shall be operated at 5.0 volts or at 3.3 volts. The output drivers are sized to provide sufficient output current to drive a wide variety of logic families. However, large drive currents tend to cause glitches on the supplies and may affect SINAD performance. Applications requiring the ADC to drive large capacitive loads or large fanout may require additional decoupling capacitors on DRVDD. In extreme cases, external buffers or latches may be required. 9
HMXADC9225
GROUNDING AND DECOUPLING
Analog and Digital Grounding Proper grounding is essential in any high speed, highresolution system. Multilayer printed circuit boards (PCBs) are recommended to provide optimal grounding and power schemes. The use of ground and power planes offers distinct advantages: 1. The minimization of the loop area encompassed by a signal and its return path. 2. The minimization of the impedance associated with ground and power paths. 3. The inherent distributed capacitor formed by the power plane, PCB insulation and ground plane. These characteristics result in both a reduction of electromagnetic interference (EMI) and an overall improvement in performance. It is important to design a layout that prevents noise from coupling onto the input signal. Digital signals should not be run in parallel with input signal traces and should be routed away from the input circuitry. While the HMXADC9225 features separate analog and driver ground pins, it should be treated as an analog component. The AVSS and DRVSS pins must be joined together directly under the HMXADC9225. A solid ground plane under the A/D is acceptable if the power and ground return currents are carefully managed. Alternatively, the ground plane under the A/D may contain serrations to steer currents in predictable directions where cross coupling between analog and digital would otherwise be unavoidable. Analog and Digital Driver Supply Decoupling The HMXADC9225 features separate analog and driver supply and ground pins, helping to minimize digital corruption of sensitive analog signals. In general, AVDD, the analog supply, should be decoupled to AVSS, the analog common, as close to the chip as physically possible. It is recommended to use 0.1 uF ceramic chip and 10 uF tantalum capacitors for the AVDD and DRVDD power inputs. A 0.1 uF ceramic chip capacitor is adequate on the CML pin.
QUALITY AND RADIATION HARDNESS ASSURANCE
Honeywell maintains a high level of product integrity through process control, utilizing statistical process and six sigma controls. It is part of a "Total Quality Assurance Program", the computer based process performance tracking system and a radiation hardness assurance strategy.
SCREENING LEVELS
Honeywell offers several levels of device screening to meet your needs. "Engineering Devices" are available with limited performance and screening for prototype development and evaluation testing. Hi-Rel Level B based and S based devices undergo additional screening per the requirements of MIL-STD-883.
RELIABILITY
Honeywell understands the stringent reliability requirements that space and defense systems requires and has extensive experience in reliability testing on programs of this nature. Reliability attributes of the SOI process were characterized by testing specially designed structures to evaluate failure mechanisms including hot carriers, electro-migration, and timedependent dielectric breakdown. The results are fed back to improve the process to ensure the highest reliability products. In addition, our products are subjected to dynamic, accelerated life tests. The packages used are qualified through MIL-STD-883, TM 5005 Class S. The product screening flow can be modified to meet the customer's specific requirements. Quality conformance testing is performed as an option on all production lots to ensure on-going reliability.
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HMXADC9225
PACKAGE OUTLINE DIMENSIONS
ORDERING INFORMATION
H MX ADC
PART TYPE PROCESS M = Mixed Signal X = SOI Source H = Honeywell PART NUMBER
9225
N
Z
SCREEN LEVEL Z = Class S\QML V Equivalent (1)
H
Y = Class B\QML Q Equivalent (1) TOTAL DOSE HARDNESS E = Eng. Model G = 5x105 rad (Si) PACKAGE DESIGNATION N = No Level Guaranteed N = 28 Pin Flat Pack
(1) This is an equivelent screening flow but not QML qualified.
To learn more about Honeywell's radiation hardened integrated circuit products and technologies, visit www.honeywell.com/microelectronics.
Honeywell reserves the right to make changes to improve reliability, function or design. Honeywell does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others.
Honeywell 12001 Highway 55 Plymouth, MN 55441 Tel: 800-323-8295 11 www.honeywell.com/ microelectronics
Form #900313 August 2006 (c)2006 Honeywell International Inc.
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